Stratos Pro A2 – 2-wire, Hazardous Area Approval.Stratos Eco – Basic, Analog, 4-wire, Hazardous Area Approval.Protos II 4400 – Modular, 2-Channel, 4-wire, Hazardous Area Approval.Protos 3400 – Modular, 2-Channel, 4-wire, Hazardous Area Approval.SE 740 – Optical, Hygenic Design, Digital.SE 715 – Amperometric, Water/Wastewater, Memosens.SE 707 – Amperometric, Trace Oxygen, Memosens.SE 706 – Amperometric, Hygenic Design, Memosens.SE 680 – Large Measuring Range, Hygenic & FDA Compliant.SE 670 – Large Measuring Range, Water/Wastewater, Compact.SE 656 – Large Measuring Range, High Chemical Resistance, Memosens.SE 655 – Large Measuring Range, Chemical Resistant, Memosens.SE 630 – 2-Electrode, Chemical Resistant, Wide Range.SE 625 – 2-electrode, High Purity, 3/4″ NPT.SE 615 – 2-Electrode, Basic, Water/Wastewater, Wide Range.SE 610 – 2-electrode, basic, Water/Wastewater, Analog.SE 605 – 2-electrode, High Purity, NPT & Hygenic Connections.SE 604 – 2-Electrode, High Purity, Straight Thread Connection.SE 603 – 4-Electrode, Corrosion Resistant.SE 600 – 4-Electrode, High Temperature/Pressure.PL PETR – Fine Solids & Plugging Media, Analog.SE 555 AMSN – All-Purpose, CIP/SIP, Memosens. ![]() SE 554 AMSN – Fine Solids & Plugging Media, Memosens.Ring – Glasteel pH, Non-intrusive Flow-through.Reiner – Glasteel pH, Small Process Fittings.Type 40 – Glasteel Differential pH, Long Insertion.Type 18 – Glasteel Differential pH for Extreme Process Conditions.PL H-93 – PTFE Diaphragm, High Alkaline Liquids.SE 571 – PTFE Annular Diaphragm, Applications with Buildup.SE 560 – High Purity, Requires Liquid Electrolyte Vessel.SE 557 – High purity, refillable liquid electrolyte.As long as AMD's AM5 chips have the same TDP, you should be good, but do keep it in mind, especially if you're looking into buying a higher-performance chip like a Ryzen 9. Of course, you'll need to consider other things, like thermal density and power requirements, if you're thinking about keeping your current cooler a few years from now. This means that if you have an AM4 system right now and you're thinking about an AM5 upgrade, all you need to do is swap out the motherboard and the CPU-your cooler will work flawlessly. Even though it uses a different packaging system entirely, AMD was able to keep the same mounting method, holes, and bracket compatibility from AM4 into AM5. This won't be the case with AM5, at least according to AMD. ![]() Users who wanted to re-use their old coolers had to get a new bracket, and those who couldn't do that were forced to get themselves new coolers. We noticed this problem recently during the transition from LGA 1200 (Comet Lake/Rocket Lake) to LGA 1700 (Alder Lake). Intel, who famously switches sockets every two or three generations, has issues keeping socket compatibility intact. There's still a possibility that you might break things, but it's harder to break a pin on the motherboard than it is to break a pin on a CPU. The pins still exist, but now they're located in the CPU socket rather than on the CPU package. LGA, or land grid array, doesn't have any pins on the CPU package. LGA, however, takes a different approach to things. The underside pins are exceptionally delicate, and if you're not gentle enough with your CPU, you might end up breaking those pins accidentally-and depending on the pins you knocked down, it could either be okay, slightly malfunctioning, to straight-up dead. This is all great until you start considering the disadvantages of this design. These CPUs go into a socket with the same amount of holes and get held down by a retention arm before mounting a cooling method. ![]() In a PGA CPU, we have a square or rectangular package with thousands of tiny pins on the underside. PGA, or pin grid array, is probably one of the oldest packaging techniques for desktop CPUs. Now, let's briefly look at the differences between PGA and LGA. ![]() The first and perhaps most noticeable change is that the AM5 socket will use a land grid array (LGA) instead of PGA, just like Intel.
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